Lisebelisoa tsa Elektronike tse Hatisitsoeng
Phekolo e nepahetseng ea Plasma bakeng sa Lisebelisoa tsa Elektronike tse Hatisitsoeng le Lisebelisoa tse Fetohang
Kalafo e tsoetseng pele ea holim'a plasma e etsa hore ho be le ntlafatso e tšepahalang ea ho khomarela ho li-substrates tse hlokolosi tse sebelisoang ho:
- Flexible Printed Circuits (FPCs)- Activating polyimide (PI) le lifilimi tsa PET bakeng sa khokahanyo ea enke ea conductive
- OLED/LCD Displays - Pre{1}}lamination treatment of ultra{2}thin thin glass (UTFG) and ITO coatings
- Thin-Libetri tsa Filimi - Ts'ebetso ea Surface ea Li{2}}ion electrode foil
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Phephetso |
Tharollo ea Plasma |
Molemo oa Tekheniki |
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Li-polymers tsa matla a tlase holim'a metsi |
Oxygen/Argon/plasma e hlahisa hydroxyl (-OH) & carboxyl (-COOH) lihlopha |
Phokotso ea angle ea ho ikopanya ho tloha ho 80℃→ 30℃in<1s |
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Lahla{0}}lisebelisoa tse hlokolosi |
Pulsed DBD plasma at<50°C prevents thermal damage |
Phetoho ea nanoscale (<10nm depth) only |
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Ho hloleha ho khomarela UTFG |
DCSBD plasma e tlosa li-hydrocarbon ha e ntse e eketsa mesebetsi ea oksijene |
10⁵× phokotso ea ho hanyetsa lipotolohong tsa rGO |
Material-Protocols Specific
- Lifilimi tsa Polyimide (Kapton®).
Tshebetso: N₂/H₂ plasma ho 20kHz, 7kV
Sephetho: 60% e phahameng ea ho khomarela enke khahlanong le phekolo ea corona
- Ultra-Thin Glass (UTFG)
Tshebetso: Diffuse Coplanar Surface Barrier Discharge (DCSBD)
Sephetho: Keketseho ea 40% ea conductivity ho PEDOT: Liaparo tsa PSS
- Li-ion Electrode Foils
Ts'ebetso: Plama ea sepakapaka e nang le motsoako oa He/O₂
Sephetho: 15% matla a phahameng a lekhapetla liseleng tsa laminated
- Engineer-Ready Solutions for Discharge-Sensitive Materials
Sistimi ea rona e kopanya-ho beha leihlo nako ea 'nete ea ho se sebetse hantle le ho ikamahanya le maemo a matla a ho laola matla a ho thibela arcing ho:
Thempereichara-li-bio{1}}li-polymers tse hlokolosi (mohlala, li-scaffold tsa PLGA)
Likarolo tse nyane- tse nang le mohlala oa ITO
Li-separators tse nang le porous betri
- Ikopanye le Sehlopha sa Rōna sa Boenjiniere ba Surface Bakeng sa:
▶︎ Tlaleho ea tlhahlobo ea lisebelisuoa (ho kenyeletsa le data ea WCA/SEM/XPS)
▶︎ Ts'ebetso ea netefatso ka li-substrates tsa hau (PI/COP/PEN)
▶︎ Ho-katoloso ea sebaka sa marang-rang ho thibela tšenyo e tsoang